| UNITED STATES | |
| SECURITIES AND EXCHANGE COMMISSION | |
| Washington, D.C. 20549 | |
| Notice of Effectiveness | |
| Effectiveness Date: | January 9, 2026 4:00 P.M. |
| Form: | S-3 | ||||||
| |||||||
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DEF 14A - Fabric.AI, Inc. (0001086745) (Filer)
PRE 14A - Fabric.AI, Inc. (0001086745) (Filer)
10-Q - Fabric.AI, Inc. (0001086745) (Filer)
NEW YORK, NY, May 06, 2026 (GLOBE NEWSWIRE) -- Fabric.AI (NASDAQ:FABC) ("Fabric.AI" or "the Company"), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation "AI factories," today announced the appointment of Bill Maffucci as Head of Development for the jointly developed Neural I/o™ chip program — a MicroLED-based optical interconnect that represents a cornerstone technology underpinning next-generation AI factory infrastructure. In this role, Maffucci will lead end-to-end development of the Fabric.AI / Kopin Neural I/o chip, a high-performance MicroLED optical interconnect designed to enable seamless, ultra-high-bandwidth communication b
NEW YORK, NY, April 29, 2026 (GLOBE NEWSWIRE) -- Fabric.AI, Inc. (NASDAQ:FABC) ("Fabric. AI" or, the "Company"), an AI infrastructure company developing a suite of fabless semiconductor technologies for next generation "AI factories," today announced that its common stock will begin trading under the new ticker symbol "FABC" on the Nasdaq Capital Market effective at the market open on April 29, 2026. The ticker change reflects the Company's completed transformation from its prior identity as StableX Technologies into Fabric.AI, a company now focused on building foundational infrastructure for artificial intelligence systems. As part of this transition, the Company has shifted its strategi
Secures $15M Initial Development Order Jointly developed Neural I/o™ MicroLED based architecture expected to provide an ultra-high-speed, ultra-low power optical transceiver for GPU-to-GPU, board-to-board and rack-to-rack communications Positions Kopin and Fabric.AI as critical enablers in the rapidly expanding AI hardware ecosystem Kopin Corporation (NASDAQ:KOPN), a leading provider of application-specific optical systems and high-performance microdisplays, including MicroLED displays, today announced a strategic collaboration with Fabric.AI (NASDAQ:SBLX), a leading developer of fabless semiconductor solutions for AI infrastructure, to develop MicroLED-based optical interconnect
3 - Fabric.AI, Inc. (0001086745) (Issuer)
4 - StableX Technologies, Inc. (0001086745) (Issuer)
4 - StableX Technologies, Inc. (0001086745) (Issuer)
NEW YORK, NY, May 06, 2026 (GLOBE NEWSWIRE) -- Fabric.AI (NASDAQ:FABC) ("Fabric.AI" or "the Company"), an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation "AI factories," today announced the appointment of Bill Maffucci as Head of Development for the jointly developed Neural I/o™ chip program — a MicroLED-based optical interconnect that represents a cornerstone technology underpinning next-generation AI factory infrastructure. In this role, Maffucci will lead end-to-end development of the Fabric.AI / Kopin Neural I/o chip, a high-performance MicroLED optical interconnect designed to enable seamless, ultra-high-bandwidth communication b
Also Appoints Experienced Public Company Director Wayne Walker as Independent Member of the Board Announces Actions to Help Realize the Full Value of The Pitney Bowes Bank and the Company's Global Financial Services Business Pitney Bowes Inc. (NYSE:PBI) ("Pitney Bowes" or, the "Company"), a technology-driven products and services company that provides SaaS shipping solutions, mailing innovation, and financial services to clients around the world, today announced the following actions associated with the initial phase of its strategic review announced in May 2025: The Appointment of Todd Everett as EVP and President of Sending Technology Solutions ("SendTech"): Mr. Everett has approxi